PCB常见的专业术语（中英文对照）
允许：permit
制造：manufacture
修改：revision
公差：tolerance
忽略：ignore(omit)
工具孔：tooling hole
安装孔：mounting hole
元件孔：component hole
槽孔：slot
邮票孔：snap off hole
导通孔：via
盲孔：blind via
埋孔：buried via
金属化孔：PTH(plating through hole)
非金属化孔：NPTH( no plating through hole)
孔位：hole location
避免：avoid
原设计：original design
修改：modify
按原设计：leave it as it is
附边：waste tab
铜条：copper strip
拼板强度：panel strong
板厚：board thickness
删除：remove(delete)
削铜：shave the copper
露铜：copper exposure
光标点：fiducial mark
不同：be different from(differ from)
内弧：inside radius
焊环：annular ring
单板尺寸：single size
拼板尺寸：panel size
铣：routing
铣刀：routerV-cut：scoring
哑光：matt
光亮的：glossy
锡珠：solder ball(solder plugs)
阻焊：solder mask(solder resist)
阻焊开窗：solder mask opening
单面开窗：single side mask opening
补油：touch up solder mask
补线：track welds
毛刺：burrs
去毛刺：deburr
镀层厚度：plating thickness
清洁度：cleanliness
离子污染：ionic contamination
阻燃性：flammability retardant
黑化：black oxidation
棕化：brown oxidation
红化：red oxidation
可焊性：solderability
焊料：solder
包装：packaging
角标：corner mark
特性阻抗：characteristic impedance
正像：positive
负片：negative
镜像：mirror
线宽：conductor width
线距：conductor spacing
做样：build sample
按照：as per
成品：finished
做变更：make the chang
相类似：similar to
规格：specification
下移：shift down
垂直地：vertically
水平的：horizontally
增大：increase
缩小：decrease
表面处理：Surface Finishing
波峰焊：wave solder
钻孔数据：drilling date
标记：Logo Ul
标记：Ul Marking
蚀刻标记：etched marking
周期：date code
翘曲：bow and twist
外层：outer layer
内层：internal layer
顶层：top layer
底层：bottom layer
元件面：component side
焊接面：solder side
阻焊层：solder mask layer
丝印层：legend layer (silkscreen layer or over layer)
兰胶层：peelable SM layer
贴片层：paste mask layer
碳油层：carbon layer
外形层：outline layer(profile layer)
白油：white ink绿油：green ink
喷锡：hot air leveling (HAL)
水金：flash gold
插头镀金：plated gold edge-board contacts
金手指：Gold-finger
防氧化：Entek(OSP)
沉金：Immersion gold (chem. Gold)
沉锡：Immersion Tin(chem.Tin)
沉银：Immersion Silver (chem. silver)
铣：CNC (mill , routing)
冲：punching
倒角：beveling
倒斜角：chamfer
倒圆角：fillet
尺寸：dimension
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